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Lenovo Intel Xeon Gold 6128 processor 3.4 GHz 19.25 MB L3
£3,287.75
£2,739.79
Out Of Stock
SKU
7XG7A05544
Intel Xeon Gold 6128 6C 115W 3.4GHz ThinkSystem SR630 Processor option kit
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring.
Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Specifications
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.4 GHz |
| Cooler included | Yes |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 115 W |
| Processor cache | 19.25 MB |
| Processor model | 6128 |
| Processor threads | 12 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 6 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 115 W |
| Technical details | |
|---|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 115 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 115 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 74 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |